Journal of Systems Engineering and Electronics ›› 2023, Vol. 34 ›› Issue (4): 1063-1073.doi: 10.23919/JSEE.2023.000108

• RELIABILITY • Previous Articles    

Reliability modeling of mutual DCFP considering failure physical dependency

Ying CHEN(), Tianyu YANG(), Yanfang WANG()   

  1. 1 Science and Technology on Reliability and Environmental Engineering Laboratory, Beihang University, Beijing 100191, China
  • Received:2021-02-03 Online:2023-08-18 Published:2023-08-28
  • Contact: Tianyu YANG E-mail:cheny@buaa.edu.cn;yangtianyu@buaa.edu.cn;Wang_YF@buaa.edu.cn
  • About author:
    CHEN Ying was born in 1977. She received her Ph.D. degree in instrument science and technology from Tsinghua University, Beijing, China, in 2006. She was a visiting scholar of University of California, Los Angeles during 2016−2017. She is currently an associate professor with the Science and Technology on Reliability and Environmental Engineering Laboratory, Beihang University. Her research interests include failure behavior and reliablity modeling method, and risk science. E-mail: cheny@buaa.edu.cn

    YANG Tianyu was born in 1996. She received her bachelor ’s degree from Beihang University in 2018. She is now a master student in the Science and Technology on Reliability and Environmental Engineering Laboratory, Beijing, China. She is specialized in the systems engineering, the reliability of electronic products and the system failure behavior. E-mail: yangtianyu@buaa.edu.cn

    WANG Yanfang was born in 1998. She received her B.S. degree from Hebei University of Technology in 2020. She is now pursing her M.S. degree in the Science and Technology on Reliability and Environmental Engineering Laboratory, Beihang University, Beijing, China. Her primary research interests include the reliability of electronic products and the system failure behavior. E-mail: Wang_YF@buaa.edu.cn
  • Supported by:
    This work was supported by the National Natural Science Foundation of China (61503014; 62073009)

Abstract:

Degradation and overstress failures occur in many electronic systems in which the operation load and environmental conditions are complex. The dependency of them called dependent competing failure process (DCFP), has been widely studied. Electronic system may experience mutual effects of degradation and shocks, they are considered to be interdependent. Both the degradation and the shock processes will decrease the limit of system and cause cumulative effect. Finally, the competition of hard and soft failure will cause the system failure. Based on the failure mechanism accumulation theory, this paper constructs the shock-degradation acceleration and the threshold descent model, and a system reliability model established by using these two models. The mutually DCFP effect of electronic system interaction has been decomposed into physical correlation of failure, including acceleration, accumulation and competition. As a case, a reliability of electronic system in aeronautical system has been analyzed with the proposed method. The method proposed is based on failure physical evaluation, and could provide important reference for quantitative evaluation and design improvement of the newly designed system in case of data deficiency.

Key words: electronic system, dependent competing failure process (DCFP), failure physical dependency, threshold descent model, competition failure modes