Journal of Systems Engineering and Electronics ›› 2020, Vol. 31 ›› Issue (5): 899-907.doi: 10.23919/JSEE.2020.000059

• Electronics Technology • Previous Articles     Next Articles

A transceiver frequency conversion module based on 3D micropackaging technology

Boyuan LIU(), Qingping WANG*(), Weiwei WU(), Naichang YUAN()   

  • Received:2019-08-10 Online:2020-10-30 Published:2020-10-30
  • Contact: Qingping WANG E-mail:233933183@qq.com;wangqingping@nudt.edu.cn;wuweiwei@nudt.edu.cn;yuannaichang@nudt.edu.cn
  • About author:LIU Boyuan was born in 1991. He received his master's degree from University of Electronic Science and Technology, China. Now he is pursuing his Ph.D. degree in National University of Defense Technology. He is now engaged in projects including Compound Electromagnetic Material and CrossEye Jamming. His research interests include microwave and millimeter wave circuits and system, radar guidance, electronic countermeasures and electromagnetic technology. E-mail: 233933183@qq.com|WANG Qingping was born in 1988. He received his Ph.D. degree from National University of Defense Technology (NUDT), China, in 2015. He is currently a lecturer with the Department of Electrical Science and Engineering, NUDT, Changsha, China. His current research interests include highresolution radar signal processing and anti-jamming technology. E-mail: wangqingping@nudt.edu.cn|WU Weiwei was born in 1981. She received her Ph.D. degree from National University of Defense Technology (NUDT), China, in 2011. She is now an associate professor with the Department of Electronic Science and Engineering, NUDT, Changsha, China. Her research interests include electromagnetic properties of new metamaterials and their applications in antennas and radomes. E-mail: wuweiwei@nudt.edu.cn|YUAN Naichang was born in 1965. He received his Ph.D. degree from University of Electronic Science and Technology, Chengdu, China, in 1994. From that on, he has stayed in National University of Defense Technology (NUDT) for ten years, where he became a senior research officer and group leader. He is currently a full professor with the Department of Electrical Science and Engineering, NUDT, Changsha, China. His current research interests include antenna and radome technology, electromagnetic analysis, high-resolution radar signal processing and anti-jamming technology. E-mail: yuannaichang@nudt.edu.cn

Abstract:

The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology, the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits (MMIC) operating chip, the 3D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board (PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.

Key words: Ku-band, frequency conversion, 3D packaging, chip, electromagnetic compatibility